ITOI Enterprises: Material Specifications

ITOI Enterprises P.O. Box 59 Newton, MA 02461 USA tel: (617) 332-1010 eMail: itoi@ultranet.com

MATERIALS

All materials used in ITOI products are designed to insure consistent product performance and extended product lifetime. Our guarantee is that you will be 100% satisfied with every aspect of every product and that our products will provide complete protection for your valuable Integrated Circuit components.

Conductive Foam

We use the highest quality conductive foam we know of in all our ITOI container products. The material is used to safely retain DIP/SIP components or is molded to make up our SMT Nesting Inserts for helding and protecting SMT ICs. It is a high density, non-humidity dependent, volume conductive, non-sloughing (i.e. no particles will scrape off) cross-linked polyethylene with indefinite shelf-life and excellent lead insertion/retention characteristics and contains no chloroflurocarbons.

Conductive Foam Specifications:

Density: 2.8 lbs/ft³
Surface Resistivity: 5.0 x 10³
Surface Resistance: 2000 Ohms at 3^"
Volume Resistivity: 3.5 x 10² Ohm-Cm
Volume Resistance: 200 Ohms

Static Dissipating Outer Covers

The material we use as the outer cover on our album products and as the surface sleeves on our ChipPage and ChipTray products is a permanently static dissipating PVC material. It is of contact clarity and is manufactured by applying a formulated coating to the surface of a radiation stabilized PVC material using an electron beam coating process. Unless subject to a heavy water flushing, its electrical specifications are permanent.

Cover & Sleeve Material Specifications:

Surface Resistivity: 10¹⁰ Ohms/Sq (Test Method ASTM D-257)
Static Decay: <2 Sec (ASTM 101 Mthd 4046)
Contact Corrosivity: None

Anti-Static Coating

We use the finest topical coating on the market today for surface static control on container surfaces not fabricated of protective materials. The coating is abrasion resistant and extremely long lasting -- indefinitely on internal surfaces -- and contains no phosphates or alkalis. It is non-toxic, non-flammable, non-staining and complelely biodegradable. Treated surfaces meet MIL-B-81705B when tested to ASTM 101B Mthd 4046.

Anti-Static Foam

The pink, polyether, anti-static foam cushioning used for protecting ICs in our ChipShip products is also useful for retaining SMT ICs in our ChipPocket and ChipTray products. Its static protection properties are indefinite in the container applications of ITOI products.

Anti-Static Foam Specifications:

Density: 1.5 lbs/ft³
Surface Resistivity: 10¹⁰ Ohms/Sq (Test Method ASTM D-257)
Static Decay: <2 Sec (ASTM 101 Mthd 4046)
Contact Corrosivity: None